Chip Scale Package: Design, Materials, Process, Reliability, and Applications

作者: John H Lau\Ricky S Lee
出版社: McGraw-Hill Professional
出版年: 1999-02-01
定价: 760.8
ISBN: 9780070383043
目前无人评价

在哪儿借这本书  · · · · · ·

谁读这本书?

二手市场

订阅关于Chip Scale Package: Design, Materials, Process, Reliability, and Applications的评论:
feed: rss 2.0