Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces 短评
作者: Beth Keser (Editor), Steffen Krouml;hnert (Editor)
副标题: High Performance Compute and System-in-Package
isbn: 1119793777
书名: Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces
页数: 320
定价: 937元
出版年: 2021-12-7
装帧: Hardcover
还没人写过短评呢