Extreme Ultraviolet Lithography

Master Extreme Ultraviolet Lithography Techniques Produce high-density, ultrafast microchips using the latest EUVL methods. Written by industry experts, Extreme Ultraviolet Lithography details the equipment, materials, and procedures required to radically extend fabrication capabilities to wavelengths of 32 nanometers and below. Work with masks and resists, configure high-reflectivity mirrors, overcome power and thermal challenges, enhance resolution, and minimize wasted energy. You will also learn how to use Mo/Si deposition technology, fine-tune performance, and optimize cost of ownership. Design EUVL-ready photomasks, resist layers, and source-collector modules Assemble optical components, mirrors, microsteppers, and scanners Harness laser-produced and discharge pulse plasma sources Enhance resolution using proximity correction and phase-shift Generate modified illumination using holographic elements Measure critical dimensions using metrology and scatterometry Deploy stable Mo/Si coatings and high-sensitivity multilayers Handle mask defects, layer imperfections, and thermal instabilities